Low-Temperature Chemical Vapor Deposition of SiCN for Hybrid Bonding

Onishi, KokiKokiOnishiIwata, TomoyaTomoyaIwataHabuka, HitoshiHitoshiHabukaNagano, FuyaFuyaNaganoInoue, FumihiroFumihiroInoue2022-12-192022-09-222022-12-192022naWOS:000851392600030https://imec-publications.be/handle/20.500.12860/40482Low-Temperature Chemical Vapor Deposition of SiCN for Hybrid BondingProceedings paper10.23919/ICEP55381.2022.9795550978-4-9911911-3-8WOS:000851392600030