A Modeling Study of Stacked Cu-CNT TSV on Electrical, Thermal, and Reliability Analysis

Xu, BaohuiBaohuiXuChen, RongmeiRongmeiChenZhou, JiurenJiurenZhouLiang, JieJieLiang2024-01-082023-08-212024-01-0820240018-9383WOS:001035869100001https://imec-publications.be/handle/20.500.12860/42374A Modeling Study of Stacked Cu-CNT TSV on Electrical, Thermal, and Reliability AnalysisJournal article10.1109/TED.2023.3293780WOS:001035869100001THROUGH-SILICONTEMPERATURE-COEFFICIENTPERFORMANCE ANALYSISCARBONRESISTANCEINTERCONNECTSCONDUCTIVITYEND