Wafer backside thinning process integrated with post-thinning clean and TSV exposure recess etch

Zhao, MingMingZhaoHayakawa, SusumuSusumuHayakawaNishida, YoshiteruYoshiteruNishidaJourdain, AnneAnneJourdainTabuchi, TomotakaTomotakaTabuchiLeunissen, PeterPeterLeunissen2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/21930Wafer backside thinning process integrated with post-thinning clean and TSV exposure recess etchProceedings paper