Van Aelst, JokeJokeVan AelstStruyf, HerbertHerbertStruyfBoullart, WernerWernerBoullartVanhaelemeersch, SergeSergeVanhaelemeersch2021-10-172021-10-1720080040-6090https://imec-publications.be/handle/20.500.12860/14595High aspect ratio via etch development for Cu nails in 3-D-stacked ICsJournal articlewww.sciencedirect.com