Probing complexities of 3D-stacked ICs – A test engineers' perspective

Fodor, FerencFerencFodorDe Wachter, BartBartDe WachterPodpod, ArnitaArnitaPodpodStucchi, MicheleMicheleStucchiMarinissen, Erik JanErik JanMarinissen2021-10-282021-10-282020-11https://imec-publications.be/handle/20.500.12860/35127Probing complexities of 3D-stacked ICs – A test engineers' perspectiveMeeting abstracthttps://pld.ttu.ee/3dtest20/index.php?page=45