Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures

Degryse, DominiekDominiekDegryseLabie, RietRietLabieVandevelde, BartBartVandeveldeGonzalez, M.M.GonzalezBeyne, EricEricBeyne2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6246Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structuresProceedings paper