Two-step room temperature grain growth in electroplated copper

Brongersma, SywertSywertBrongersmaRichard, EmmanuelEmmanuelRichardVervoort, IwanIwanVervoortBender, HugoHugoBenderVandervorst, WilfriedWilfriedVandervorstLagrange, SébastienSébastienLagrangeBeyer, GeraldGeraldBeyerMaex, KarenKarenMaex2021-10-062021-10-061999https://imec-publications.be/handle/20.500.12860/3278Two-step room temperature grain growth in electroplated copperJournal article