Via-last airgap liner TSV for ultra-low capacitance applications

Civale, YannYannCivaleGonzalez, MarioMarioGonzalezSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanTravaly, YoussefYoussefTravalySoussan, PhilippePhilippeSoussanBeyne, EricEricBeyne2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/16875Via-last airgap liner TSV for ultra-low capacitance applicationsProceedings paper