One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material

Flack, WarrenWarrenFlackHsieh, RobertRobertHsiehNguyen, Ha-AiHa-AiNguyenSlabbekoorn, JohnJohnSlabbekoornSuhard, SamuelSamuelSuhardMiller, AndyAndyMillerHiro, AkitoAkitoHiroHidremont, RomainRomainHidremont2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30709One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric materialProceedings paperhttps://ieeexplore.ieee.org/document/8654363