Optimization methods for post-bond testing of 3D stacked ICs

Noia, BrandonBrandonNoiaChakrabarty, KrishnenduKrishnenduChakrabartyMarinissen, Erik JanErik JanMarinissen2021-10-202021-10-202012-020923-8174https://imec-publications.be/handle/20.500.12860/21210Optimization methods for post-bond testing of 3D stacked ICsJournal articlehttp://dx.doi.org/10.1007/s10836-011-5233-8