Process integration induced thermodesorption from SiO2/SiLK resin dielectric based interconnects

Baklanov, MikhaïlMikhaïlBaklanovMuroyama, M.M.MuroyamaJudelewicz, MosheMosheJudelewiczKondoh, EiichiEiichiKondohLi, H.H.LiWaeterloos, JoostJoostWaeterloosVanhaelemeersch, SergeSergeVanhaelemeerschMaex, KarenKarenMaex2021-10-062021-10-061999https://imec-publications.be/handle/20.500.12860/3209Process integration induced thermodesorption from SiO2/SiLK resin dielectric based interconnectsJournal article