Capacitance reduction technique for through silicon via (TSV) in p-Si substrate

Katti, GuruprasadGuruprasadKattiStucchi, MicheleMicheleStucchiDe Meyer, KristinKristinDe MeyerDehaene, WimWimDehaene2021-10-182021-10-1820100741-3106https://imec-publications.be/handle/20.500.12860/17355Capacitance reduction technique for through silicon via (TSV) in p-Si substrateJournal article