Reducing the electrodeposition time for filling microvias with copper for 3D technology

Luhn, OleOleLuhnRadisic, AlexAlexRadisicVereecken, PhilippePhilippeVereeckenSwinnen, BartBartSwinnenVan Hoof, ChrisChrisVan HoofRuythooren, WouterWouterRuythoorenCelis, Jean-PierreJean-PierreCelis2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14075Reducing the electrodeposition time for filling microvias with copper for 3D technologyProceedings paper