Vandevelde, BartBartVandeveldeChristiaens, FilipFilipChristiaensBeyne, EricEricBeyneRoggen, JeanJeanRoggenPeeters, J.J.PeetersAllaert, K.K.Allaert2021-09-302021-09-301997https://imec-publications.be/handle/20.500.12860/2266Thermo-mechanical analysis of flip chip on substrate bumps - assembliesProceedings paper