Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip

Oprins, HermanHermanOprinsCherman, VladimirVladimirChermanVan der Plas, GeertGeertVan der PlasMaggioni, FedericaFedericaMaggioniDe Vos, JoeriJoeriDe VosWang, TengTengWangDaily, RobertRobertDailyBeyne, EricEricBeyne2021-10-222021-10-222015-05https://imec-publications.be/handle/20.500.12860/25712Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chipProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159737