Halder, SandipSandipHalderStiers, KarenKarenStiersMiller, AndyAndyMillerDe Wolf, IngridIngridDe WolfPhommahaxay, AlainAlainPhommahaxayMaenhoudt, MireilleMireilleMaenhoudtBeyne, EricEricBeyneGuerrieri, StefanoStefanoGuerrieri2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/22453Metrology and inspection challenges for manufacturing 3D stacked IC'sProceedings paper