High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package

Podpod, ArnitaArnitaPodpodVelenis, DimitriosDimitriosVelenisPhommahaxay, AlainAlainPhommahaxayBex, PieterPieterBexFodor, FerencFerencFodorMarinissen, Erik JanErik JanMarinissenRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-262021-10-262018https://imec-publications.be/handle/20.500.12860/31549High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level packageProceedings paperhttps://ieeexplore.ieee.org/document/8573262