Jourdan, NicolasNicolasJourdanMachillot, JeromeJeromeMachillotBarbarin, YohanYohanBarbarinSiew, Yong KongYong KongSiewAi, HuaHuaAiCockburn, AndrewAndrewCockburnNguyen, Mai PhuongMai PhuongNguyenVan Elshocht, SvenSvenVan ElshochtBoemmels, JuergenJuergenBoemmelsLakshmanan, A.A.LakshmananMa, PaulPaulMaNarasimhan, MuraliMuraliNarasimhanTokei, ZsoltZsoltTokei2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/22559CVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologiesMeeting abstract