An investigation into damage-free thin die pick and place for 3D stacking

Malachowski, KarlKarlMalachowskiGonzales, DennisDennisGonzalesMiller, AndyAndyMillerLa Manna, AntonioAntonioLa MannaHajdarevic, ZlatkoZlatkoHajdarevicSchnegg, FabianFabianSchneggArzberger, AntonAntonArzberger2021-10-192021-10-192011-12https://imec-publications.be/handle/20.500.12860/19359An investigation into damage-free thin die pick and place for 3D stackingProceedings paper