The evaluation and the inegration of low-k organic spin-on materials in a non-etchback interconnect process

Meynen, HermanHermanMeynenWaeterloos, JoostJoostWaeterloosCoenegrachts, BartBartCoenegrachtsGao, TengTengGaoGrillaert, JoostJoostGrillaertVan den hove, LucLucVan den hove2021-09-292021-09-291996https://imec-publications.be/handle/20.500.12860/1351The evaluation and the inegration of low-k organic spin-on materials in a non-etchback interconnect processOral presentation