Modeling copper plastic deformation and liner viscoelastic flow effects on performance and reliability in Through Silicon Via (TSV) fabrication processes

Karmarkar, A.P.A.P.KarmarkarXu, X.X.XuEl Sayed, K.K.El SayedGuo, WeiWeiGuoVan der Plas, GeertGeertVan der PlasVan Huylenbroeck, StefaanStefaanVan HuylenbroeckGonzalez, MarioMarioGonzalezAbsil, PhilippePhilippeAbsilBeyne, EricEricBeyne2021-10-272021-10-2720191530-4388https://imec-publications.be/handle/20.500.12860/33254Modeling copper plastic deformation and liner viscoelastic flow effects on performance and reliability in Through Silicon Via (TSV) fabrication processesJournal articlehttps://ieeexplore.ieee.org/document/8832265