An analytical compact model for estimation of stress in multiple through-silicon via configurations

Eneman, GeertGeertEnemanCho, Jong HoonJong HoonChoMoroz, VictorVictorMorozMilojevic, DragomirDragomirMilojevicChoi, MunkangMunkangChoiDe Meyer, KristinKristinDe MeyerMercha, AbdelkarimAbdelkarimMerchaBeyne, EricEricBeyneHoffmann, Thomas Y.Thomas Y.HoffmannVan der Plas, GeertGeertVan der Plas2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/18885An analytical compact model for estimation of stress in multiple through-silicon via configurationsProceedings paper