Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing

Jacobs, Kristof J.P.Kristof J.P.JacobsLi, YunlongYunlongLiVan Huylenbroeck, StefaanStefaanVan HuylenbroeckDe Wolf, IngridIngridDe WolfBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33206Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessingProceedings paperhttps://asm.confex.com/asm/istfa19/webprogram/Paper48350.html