Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN-SiCN Wafer-to-Wafer Hybrid-Bonding Technologies

Chery, EmmanuelEmmanuelCheryFohn, CorinnaCorinnaFohnDe Messemaeker, JokeJokeDe MessemaekerBeyne, EricEricBeyne2024-03-122024-01-152024-03-1220231530-4388WOS:001121936200016https://imec-publications.be/handle/20.500.12860/43422Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN-SiCN Wafer-to-Wafer Hybrid-Bonding TechnologiesJournal article10.1109/TDMR.2023.3327664WOS:001121936200016DIELECTRICSBREAKDOWN