Cherman, VladimirVladimirChermanLofrano, MelinaMelinaLofranoSimons, VeerleVeerleSimonsGonzalez, MarioMarioGonzalezVan der Plas, GeertGeertVan der PlasDe Vos, JoeriJoeriDe VosWang, TengTengWangDaily, RobertRobertDailySalahouelhadj, AbdellahAbdellahSalahouelhadjBeyer, GeraldGeraldBeyerLa Manna, AntonioAntonioLa MannaDe Wolf, IngridIngridDe WolfBeyne, EricEricBeyne2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25073Effects of packaging on mechanical stress in 3D-ICsProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159617