Thiol based self-assenbled monolayers (SAMs) as an alternative surface finish for 3D Cu microbumps

Armini, SilviaSilviaArminiVandelaer, YannickYannickVandelaerLesniewska, AlicjaAlicjaLesniewskaCherman, VladimirVladimirChermanDe Preter, IngeIngeDe PreterInoue, FumihiroFumihiroInoueDerakhshandeh, JaberJaberDerakhshandehVakanas, GeorgeGeorgeVakanasBeyne, EricEricBeyne2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/24942Thiol based self-assenbled monolayers (SAMs) as an alternative surface finish for 3D Cu microbumpsProceedings paper