Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfill

Sphabmixay, KimKimSphabmixayVan Olmen, JanJanVan OlmenMoon, Kwang JinKwang JinMoonVanstreels, KrisKrisVanstreelsD'Haen, JanJanD'HaenTokei, ZsoltZsoltTokeiList, S.S.ListBeyer, GeraldGeraldBeyer2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/12935Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfillJournal article