Vandecasteele, BjornBjornVandecasteeleVanfleteren, JanJanVanfleterenManessis, D.D.ManessisOstmann, A.A.OstmannHagedorn, H.W.H.W.HagedornWiese, JJWiese2021-10-162021-10-162005-06https://imec-publications.be/handle/20.500.12860/11450Lead-free flip chip: a comparison between lead-free solder and adhesivesProceedings paper