On maximizing the compound yield for 3D wafer-to-wafer stacked ICs

Taouil, MottaqiallahMottaqiallahTaouilHamdioui, SaidSaidHamdiouiVerbree, JoukeJoukeVerbreeMarinissen, Erik JanErik JanMarinissen2021-10-182021-10-182010-10https://imec-publications.be/handle/20.500.12860/18071On maximizing the compound yield for 3D wafer-to-wafer stacked ICsProceedings paper