FI-CDM and LICCDM testing on wafer, single die and package levels

Simicic, MarkoMarkoSimicicTakenaka, HiroshiHiroshiTakenakaTamura, ShinichiShinichiTamuraClaes, DieterDieterClaesShimada, YoheiYoheiShimadaSawada, MasanoriMasanoriSawadaChen, Shih-HungShih-HungChen2025-06-252024-12-012025-06-252024979-8-3503-6546-70739-5159WOS:001337944800026https://imec-publications.be/handle/20.500.12860/44882FI-CDM and LICCDM testing on wafer, single die and package levelsProceedings paper10.23919/EOS/ESD61719.2024.10702171978-1-58537-353-6WOS:001337944800026