Low-cost post-bond testing of 3D-ICs containing a passive silicon interposer base

Chi, Chun-ChuanChun-ChuanChiMarinissen, Erik JanErik JanMarinissenGoel, Sandeep KumarSandeep KumarGoelWu, Cheng-WenCheng-WenWu2021-10-222021-10-222014-111063-8210https://imec-publications.be/handle/20.500.12860/23643Low-cost post-bond testing of 3D-ICs containing a passive silicon interposer baseJournal articlehttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6680768