Wafer scale copper direct plating on thin PVD RuTa layers: A route to enable filling 30 nm features and below?

Armini, SilviaSilviaArminiEl-Mekki, ZaidZaidEl-MekkiNagar, MargalitMargalitNagarRadisic, AlexAlexRadisicVereecken, PhilippePhilippeVereecken2021-10-222021-10-2220140013-4651https://imec-publications.be/handle/20.500.12860/23502Wafer scale copper direct plating on thin PVD RuTa layers: A route to enable filling 30 nm features and below?Journal articlehttp://jes.ecsdl.org/content/161/10/D564.abstract