A quantitative study of the adhesion between copper, barrier and organic low-k polymers

Lanckmans, FilipFilipLanckmansBrongersma, SywertSywertBrongersmaVarga, IstvanIstvanVargaBeyne, EricEricBeyneMaex, KarenKarenMaex2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4511A quantitative study of the adhesion between copper, barrier and organic low-k polymersOral presentation