A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabrication

Kruv, AnastasiiaAnastasiiaKruvGonzalez, MarioMarioGonzalezOkudur, Oguzhan OrkutOguzhan OrkutOkudurSpampinato, ValentinaValentinaSpampinatoFranquet, AlexisAlexisFranquetVadakupudhu Palayam, SenthilSenthilVadakupudhu PalayamArreghini, AntonioAntonioArreghiniVan den Bosch, GeertGeertVan den BoschRosmeulen, MaartenMaartenRosmeulenDe Wolf, IngridIngridDe Wolf2023-08-072023-06-202023-08-0720220167-9317WOS:000746805100008https://imec-publications.be/handle/20.500.12860/41936A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabricationJournal article10.1016/j.mee.2021.111660WOS:000746805100008ELASTIC-MODULUSTHIN-FILMSUBSTRATE