Fine pitch micro-bump Cu/Sn solid state diffusion bonding with and without surface planarization

Zhang, WenqiWenqiZhangLa Manna, AntonioAntonioLa MannaSoussan, PhilippePhilippeSoussanBeyne, EricEricBeyne2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/21924Fine pitch micro-bump Cu/Sn solid state diffusion bonding with and without surface planarizationProceedings paper