Increasing DOF for VIA lithography using a non-CMP based architecture

Grozev, GrozdanGrozdanGrozevWaeterloos, JoostJoostWaeterloosRonse, KurtKurtRonseVan den hove, LucLucVan den hoveTzviatkov, PlamenPlamenTzviatkov2021-09-302021-09-301997https://imec-publications.be/handle/20.500.12860/1905Increasing DOF for VIA lithography using a non-CMP based architectureProceedings paper