Panchenko, IulianaIulianaPanchenkoCroes, KristofKristofCroesDe Wolf, IngridIngridDe WolfDe Messemaeker, JokeJokeDe MessemaekerBeyne, EricEricBeyneWolter, Klaus-JuergenKlaus-JuergenWolter2021-10-222021-10-2220140167-9317https://imec-publications.be/handle/20.500.12860/24361Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnectsJournal articlehttp://www.sciencedirect.com/science/article/pii/S0167931713006916