Vrana, M.M.VranaVan Calster, AndreAndreVan CalsterVan den Berghe, R.R.Van den BergheAllaert, K.K.Allaert2021-09-302021-09-301997https://imec-publications.be/handle/20.500.12860/2298Flip-chip assembly for chips with gold bumps on high density thic film substratesProceedings paper