Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bonding

Duval, FabriceFabriceDuvalWang, TengTengWangBex, PieterPieterBexLofrano, MelinaMelinaLofranoRebibis, Kenneth JuneKenneth JuneRebibisSleeckx, ErikErikSleeckxBeyne, EricEricBeyneGerets, CarineCarineGerets2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/28295Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bondingProceedings paperhttps://ieeexplore.ieee.org/document/8346836