Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis

Vandevelde, BartBartVandeveldeZanon, FrancoFrancoZanonGriffoni, AlessioAlessioGriffoniLi, XiaolingXiaolingLiWillems, GeertGeertWillemsMeneghini, MatteoMatteoMeneghini2021-10-232021-10-232015https://imec-publications.be/handle/20.500.12860/26101Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysisProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7103170