Electrical characterization method to study barrier integrity in 3D through-silicon vias

Li, YunlongYunlongLiVelenis, DimitriosDimitriosVelenisKauerauf, ThomasThomasKaueraufStucchi, MicheleMicheleStucchiCivale, YannYannCivaleRedolfi, AugustoAugustoRedolfiCroes, KristofKristofCroes2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/21021Electrical characterization method to study barrier integrity in 3D through-silicon viasProceedings paper