Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process

Gao, TengTengGaoCoenegrachts, BartBartCoenegrachtsWaeterloos, JoostJoostWaeterloosBeyer, GeraldGeraldBeyerMeynen, HermanHermanMeynenVan Hove, MarleenMarleenVan HoveMaex, KarenKarenMaex2021-09-302021-09-301998https://imec-publications.be/handle/20.500.12860/2579Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS processProceedings paper