Evaluation of post etch residue cleaning solutions for the removal of TiN hardmask after dry etch of low-k dielectric materials on 45 nm pitch interconnects

Payne, MakonnenMakonnenPayneLippy, SteveSteveLippyLieten, RubenRubenLietenKesters, ElsElsKestersLe, Quoc ToanQuoc ToanLeMurdoch, GayleGayleMurdochVega Gonzalez, VictorVictorVega GonzalezHolsteyns, FrankFrankHolsteyns2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27128Evaluation of post etch residue cleaning solutions for the removal of TiN hardmask after dry etch of low-k dielectric materials on 45 nm pitch interconnectsProceedings paperhttp://www.scientific.net/SSP.255.232