A low thermal budget pre metal dielectric stack using PECVD and HDP processing

Schaekers, MarcMarcSchaekersDe Jaeger, BriceBriceDe JaegerSleeckx, ErikErikSleeckxDebusschere, IngridIngridDebusschereVan Hove, MarleenMarleenVan HoveLauwers, A.A.LauwersHauf, H.H.Hauf2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5633A low thermal budget pre metal dielectric stack using PECVD and HDP processingOral presentation