Highlights of the dactel project: development of adhesive flip-chip technologies for dedicated electronic applications

Vanfleteren, JanJanVanfleterenVervaet, A.A.VervaetVan Calster, AndreAndreVan Calster2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4889Highlights of the dactel project: development of adhesive flip-chip technologies for dedicated electronic applicationsProceedings paper