Convolution based compact thermal model: methodology for including the thermal impact of die to die interconnections

Maggioni, FedericaFedericaMaggioniOprins, HermanHermanOprinsBeyne, EricEricBeyneDe Wolf, IngridIngridDe WolfBaelmans, TineTineBaelmans2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24178Convolution based compact thermal model: methodology for including the thermal impact of die to die interconnectionsProceedings paper