Embedded chips redefine miniaturization: inexpensive, high-performance packages can be fabricated by laminating thin, flexible, mechanical devices into conventional multiilayer circuit boards

Parton, ElsElsPartonChristiaens, WimWimChristiaensVanfleteren, JanJanVanfleteren2021-10-182021-10-182009-07https://imec-publications.be/handle/20.500.12860/15983Embedded chips redefine miniaturization: inexpensive, high-performance packages can be fabricated by laminating thin, flexible, mechanical devices into conventional multiilayer circuit boardsJournal article