Mechanical and thermal investigation of a novel intermetallic insertion bonding for 3D stack

Lofrano, MelinaMelinaLofranoHou, LinLinHouDerakhshandeh, JaberJaberDerakhshandehCherman, VladimirVladimirChermanBeyne, EricEricBeyne2021-10-292021-10-292020https://imec-publications.be/handle/20.500.12860/35500Mechanical and thermal investigation of a novel intermetallic insertion bonding for 3D stackProceedings paper