Thermal mismatch induced reliability issues for Cu filled through-silicon vias

De Messemaeker, JokeJokeDe MessemaekerCroes, KristofKristofCroesVandevelde, BartBartVandeveldeVelenis, DimitriosDimitriosVelenisRedolfi, AugustoAugustoRedolfiJourdain, AnneAnneJourdainBeyer, GeraldGeraldBeyerSwinnen, BartBartSwinnenBeyne, EricEricBeyneDe Wolf, IngridIngridDe Wolf2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20551Thermal mismatch induced reliability issues for Cu filled through-silicon viasProceedings paper