Halder, SandipSandipHalderJourdain, AnneAnneJourdainClaes, MartineMartineClaesDe Wolf, IngridIngridDe WolfTravaly, YoussefYoussefTravalyBeyne, EricEricBeyneSwinnen, BartBartSwinnenPepper, V.V.PepperGuittet, P.Y.P.Y.GuittetSavage, G.G.SavageMarkwort, LarsLarsMarkwort2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/19029Metrology and inspection for process control during bonding and thinning of stacked wafers for manufacturing 3D SIC'sProceedings paper